First flip-chip integrated devices delivered

In October 2025 we delivered our first flip-chip integrated devices.

What flip-chip is

In a flip-chip assembly, two chips are bonded face to face. One chip can carry the qubits while the other carries wiring, readout or other circuitry, and the bonds between them carry signals vertically instead of across a single surface.

Why it matters

As superconducting circuits grow, routing every line across one chip gets harder. Moving part of the circuit onto a second chip is one of the ways to build in three dimensions. For a foundry customer, it means a layout does not have to fit on a single plane.

What we can build

Flip-chip sits alongside the other integration steps in our foundry process: air bridges and under-bump metallisation. All of it is built around our Al/AlOx/Al Josephson junctions, Manhattan-style or Dolan-bridge, on 4-inch wafers.

If you are planning a 3D-integrated chip, send us a short description of what you are building. A GDS file helps, but it is not needed to start.