Foundry · Custom wafer runs
Your design, our process, a full wafer of your own.
Dedicated wafer runs for teams who need their own layout, process choices and timeline. For prototyping on a shared wafer, see Q-MPW.
Oct 2025
First flip-chip integrated devices delivered
ConScience news, 15 Oct 2025
1–40 kΩ
Junction resistance range
Foundry page and brochures, 2025
4-inch
Wafer size
Foundry page
±10%
Junction size precision, >90% yield across a 4-inch wafer
Foundry page and brochures, 2025
What we can fabricate
Capabilities
- Junctions
- Al/AlOx/Al Josephson junctions — Manhattan-style or Dolan-bridge
- Junction resistance
- 1–40 kΩ
- Junction precision
- ±10% junction size, >90% yield across a 4-inch wafer
- Qubit types
- Planar transmons, fluxonium; other architectures on request
- Integration
- Air bridges, under-bump metallisation, flip-chip for 3D-integrated chips
- Wafer size
- 4-inch
- Measured performance
- T1 up to 256 µs; resonator Qi ≳1M at single-photon powerQiB0, datasheet v2.0, Oct 2025 · QiB0/QiB2 datasheets
- Measured
How a run works
From GDS to chips
Scope call
You tell us what you're building; we tell you what's realistic and what it costs. Pricing is based on the process steps your design needs.
NDA and design hand-over
GDS files, design notes, target parameters.
Design review
We check manufacturability and flag risks before anything is patterned.
Fabrication
In the Chalmers or DTU cleanroom.
Standard lead time: 12–16 weeks
Test and delivery
Junction data and test results with every delivery.
Included: room-temperature junction-resistance map and a delivery report
Proof
What we've delivered
- 2023First quantum devices shipped to a US quantum-computing company, September 2023.
- 2025First flip-chip integrated devices delivered, October 2025.
- QiBOur own Qubit-in-a-Box chips are made on our transmon process, and their datasheets are public.
Publications by our engineers (2024)
- 2024
Mitigation of interfacial dielectric loss in aluminum-on-silicon superconducting qubits
npj Quantum Information · 10 · 78
- 2024
Physical Review Applied · 22 · 014063
- 2024
Confidentiality and export control
Your design stays yours
We sign an NDA before you send a single file. Only your team and our foundry see your design. Wafer previews show your chips and nothing else, and design data is handled on a need-to-know basis.
Shipping and export control
Our quantum devices are EU dual-use items (category 3A001). Every order needs a signed End-User Statement before shipping. Within the EU, and to Australia, Canada, Iceland, Japan, Liechtenstein, New Zealand, Norway, Switzerland, the UK and the US, no individual licence is needed. Anywhere else needs an export licence, which adds time, so tell us your destination early and we'll start the paperwork with you.
Send us what you're building.
A short description is enough to start. Attach a GDS file if you have one.